繁體中文 English Microstructured Silicon Rivals III-Vs for Photodetection Highlights Innovative Design: Novel photodetector design using micro and nano structures matches the performance of other materials
繁體中文 English Obstacles and Current Approaches for LiDAR Miniaturization In the April 2023 issue of ADAS & Autonomous Vehicles International, Dr. Sabbir Rangwala presents a
繁體中文 English NEC Corporation has developed the world’s first highly sensitive uncooled infrared image sensor NEC Corporation in Japan Develops World’s First High-Sensitivity Uncooled Infrared
繁體中文 English A briefing decrypts TSMC’s 14-year technology development roadmap of BSI Technology with Bulk Si Wafer Taiwan Semiconductor Manufacturing Company (TSMC) has made remarkable
繁體中文 English Imec thin-film pinned photodiode for SWIR sensing in Nature Electronics The nanoelectronics and digital technology research center imec in Belgium recently announced that
繁體中文 English (英語) Chip-Scale Acousto-Optic Beam Steering Enables Compact, Low-Cost LiDAR with Wide Field-of-View Summary Researchers from the University of Washington in Seattle published a
繁體中文 (Chinese (Traditional)) English 한국어 (Korean) New technology for backside polishing of silicon wafers in back-illuminated CMOS image sensor processes A research team composed of
繁體中文 English 한국어 Design of Single Photon Detector Based on InGaAs/InP NFAD by Professor Song Haizhi of Southwest Institute of Technical Physics, China A research
繁體中文 English Onsemi Annual Analysis Report: Soaring Together with Smart Power and Image Sensing On May 16, 2023, Onsemi held its annual analyst day presentation,
繁體中文 English 한국어 Groundbreaking 2019 Research on SPAD-Based LiDAR Systems: A Joint Study by University of Edinburgh Pro Robert K. Henderson and STMicroelectronics Imaging Division
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